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Compound Semiconductor National Standards System Matures as Substrate and Epitaxy Standards Roll Out
China’s compound semiconductor standardization system is maturing. National and industry standards covering gallium arsenide, silicon carbide, and indium phosphide substrates, along with epitaxial materials, are being published in a concentrated…
Global Semiconductor Equipment Sales Set for Another Record in 2026 as Wafer Cleaning Localization Accelerates
According to the latest equipment market forecast from SEMI, the global association representing the semiconductor manufacturing supply chain, worldwide sales of semiconductor fabrication equipment are on track to reach yet…
Fab Expansion Forces Facility Upgrades: Cleanrooms, UPW and Specialty Gases as New Infrastructure
The wave of fab expansion is not only pulling up process equipment procurement but also forcing a comprehensive upgrade of the ‘facility system’ behind it. Cleanroom class, ultra-pure water supply,…
China’s Wafer Cleaning Equipment Localization Crosses 50% as Single-Wafer Cleaning and Spin-Dryers Lead Fab Expansion
Domestic-made wafer cleaning equipment in China has crossed the 50% localization threshold, according to recent industry surveys, with Chinese wet-process tools winning an increasing share of tenders as domestic fabs…
China’s IC Talent Gap Tops 300,000 as Industry-Education Integration Ramps Up Equipment Engineers
As domestic fabs rush to expand capacity and the localization of semiconductor equipment enters a deeper phase, the shortage of integrated circuit (IC) talent has become a bottleneck constraining production…
Beijing-Tianjin-Hebei IC Cluster Three-Year Plan Lands, Hebei Bets on Compound Semiconductors
A new round of policy momentum is driving coordinated development of integrated circuits across the Beijing-Tianjin-Hebei region. The supporting three-year action plan has now been formally rolled out, defining a…
Global Foundry Output Hits a New Record: TSMC Leads, SMIC Holds Its Ground Among the Top Tier
The global wafer foundry industry is set to push foundry revenue to yet another record high in 2026, powered by insatiable demand for AI accelerators and high-performance computing chips. Looking…
Semiconductor Material Localization Deepens With Breakthroughs in Large Wafers and ArF Photoresist
China’s semiconductor material localization is advancing into deeper territory. Recent breakthroughs in 12-inch wafers, ArF photoresist, and electronic specialty gases mean domestic materials are being qualified and adopted in fabs…
Automotive-Grade Power Semiconductor Expansion Heats Up as IGBT and SiC Fab Investments Land
Automotive-grade power semiconductor expansion continues to heat up. Several power device makers have recently announced new and expanded IGBT and SiC lines, and strong demand from EV inverters, charging piles,…
8-Inch Silicon Carbide Substrate Moves Toward Mass Production as PVT Growth Equipment Enables Localization
Several Chinese silicon carbide substrate manufacturers have recently disclosed progress in research, development, and early shipment of 8-inch conductive substrates, signaling that third-generation semiconductor upstream materials are accelerating their transition…
AI Data Center Boom Pulls Indium Phosphide Substrate Demand Higher; Tight Supply Persists Into 2026
As 800G and even 1.6T optical modules are deployed at an accelerating pace inside AI data centers, demand for indium phosphide (InP) substrates, the core material for photonic chips, continues…
Mature-Node Utilization Nears Full Capacity as Automotive and Industrial Chips Underpin Fab Load
Following a two-year inventory correction, utilization rates at global mature-node fabs are recovering rapidly, with some lines approaching full capacity. In contrast to earlier cycles led by consumer electronics, this…
