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National IC Industry Fund Phase III Registered at RMB 344 Billion, Targeting Equipment and Materials
China’s National Integrated Circuit Industry Investment Fund, known as the Big Fund Phase III, is registered with RMB 344 billion in capital, continuing to target localization of semiconductor equipment and…
8-Inch GaN-on-Silicon Production Speeds Up as Power Devices Target AI Data Center Power
Production of 8-inch GaN-on-silicon is accelerating. As AI data centers demand ever-more efficient power, alongside growth in fast chargers and server power supplies, several Chinese 8-inch GaN power device lines…
Core Components of Cleaning Equipment Go Domestic: Valves, Pumps, MFCs and Temperature Controllers
Wafer cleaning equipment may look straightforward, but its performance depends heavily on a string of high-precision core components. As the maturity of domestic cleaning machines rises, the localization of the…
Domestic Single-Wafer Cleaning Accelerates as ACM Research Reaches About 8% Global Share
Among the global single-wafer cleaning equipment market, the rise of Chinese vendors stands out. ACM Research (Shanghai), relying on differentiated technologies such as SAPS and TEBO, has lifted its global…
Third-Generation Semiconductor Expansion Reshapes Supply as 8-Inch SiC Substrates Enter Mass Delivery
The third-generation semiconductor capacity expansion wave continues to build. Domestic SiC substrate makers have recently disclosed mass delivery progress for 8-inch conductive substrates, and the 6-inch to 8-inch transition has…
Global Wafer Cleaning Equipment Market Set for ~$6.9 Billion in 2026 as the Single-Wafer Shift Reshapes a Three-Way Race
The global wafer cleaning equipment market is projected to reach approximately 6.9 billion US dollars in 2026, according to industry research, and is expected to keep growing steadily over the…
AI Demand Ignites an HBM Capacity Build-Out as the Big Three Memory Makers Race to Add Capacity
As AI large models and AI servers drive an exponential surge in memory bandwidth demand, high-bandwidth memory, or HBM, has become the most sought-after category in the memory industry. The…
Wafer Particle and Defect Inspection Heats Up as Optical and E-Beam Routes Support Yield
Particles and defects are among the most common yield-affecting problems in wafer fabrication. As wafers move toward 12 inches and line widths shrink, a single micron-scale particle can scrap an…
TSMC’s 2-Nanometer Process Enters Mass Production, Accelerating Global Wafer Expansion
TSMC, the world’s largest pure-play foundry, has announced that its 2-nanometer process has officially entered mass production and that the capacity ramp has begun. The milestone marks the start of…
Lithography Localization Steady as 28nm Immersion DUV Enters Batch Delivery
As the highest-barrier equipment in chipmaking, lithography has long been the summit of Chinese semiconductor equipment development. In recent years, domestic lithography tools have advanced steadily on mature nodes, with…
EFEM Front-End Modules: The Clean Automation Hub Linked to Cleaning and Spin-Dry Stations
In modern wafer fabs, the EFEM (Equipment Front End Module) is the ‘clean portal’ linking the outside wafer FOUP (front opening unified pod) to process equipment. It automatically loads, aligns…
The Evolution of Wafer Spin Dryers: High RPM, Hot Nitrogen Sweep and Anti-Static Design Working as One
The wafer spin dryer (Spin Dryer, or Spin Rinse Dryer, SRD) is the key drying tool at the wet post-clean stage. As wafer sizes move from 150 mm and 200…
