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Advanced Packaging Equipment Market Keeps Expanding as HBM and 2.5D/3D Drive Back-End Demand
Driven by artificial intelligence and high-bandwidth memory demand, the advanced packaging equipment market keeps expanding. HBM stacking and 2.5D/3D packaging are the fastest-growing directions, pulling up demand for bonding, dicing,…
Marangoni and IPA Drying: How Advanced Wafer Processes Suppress Watermarks and Particle Re-deposition
At the very last step of wafer wet cleaning, ‘drying’ may look simple, yet it often turns out to be the dividing line that decides yield. When the ultra-pure water…
Semiconductor Equipment Clusters Take Shape as Yangtze Delta and Beijing-Tianjin-Hebei Advance Together
Competition in China’s semiconductor equipment industry is increasingly a competition of industrial clusters. The Yangtze River Delta, centered on Shanghai and Jiangsu, and the Beijing-Tianjin-Hebei region, are advancing together, each…
Megasonic Cleaning Goes High-Precision: Damage-Free Particle Removal Across the 950 kHz to 3 MHz Band
As cleaning objects move from micron-scale features toward nanoscale structures, traditional megasonic cleaning faces a new challenge: it must shake ultra-fine particles off patterned structures without damaging the fragile lines.…
Semiconductor Equipment Components Go Domestic as RF Power and Vacuum Systems Become Key Battlegrounds
The localization competition in semiconductor equipment is moving from whole machines into core components. Among many chokepoint parts, RF power supplies and vacuum systems are regarded as key battlegrounds. As…
China Remains the World’s Largest Semiconductor Equipment Market for Yet Another Year
In the global semiconductor equipment landscape, China has once again retained its position as the world’s largest single market. According to SEMI and other industry sources, China’s share of worldwide…
Single-Wafer vs. Batch Cleaning: Why Leading-Edge Fabs Have Pivoted to the Single-Wafer Route
In wafer wet cleaning, two technology routes have long coexisted: batch (tank) cleaning that processes a whole cassette of wafers together, and single-wafer cleaning that treats one wafer at a…
Mature-Node Expansion Concentrates in Mainland China, Accounting for About 70% of New Global Capacity
On the global map of mature-node expansion, new capacity is accelerating toward mainland China. According to industry estimates, around 70% of the world’s planned new wafer capacity in 2026 comes…
AI Infrastructure Drives a Structural Expansion in Equipment Demand, Led by HBM and Advanced Logic
The build-out of AI compute infrastructure is reshaping the structure of global semiconductor equipment demand. Unlike previous cycles led by consumer electronics, this expansion exhibits a clear structural character: HBM…
Domestic Semiconductor Equipment Goes Global as Southeast Asia Fabs Open a New Window
As the maturity of domestic semiconductor equipment rises, a new trend of going overseas is forming. As Southeast Asian fabs expand, domestic cleaning, thermal, metrology and packaging tools are following…
Naura and AMEC Release 2025 Annual Results as China’s Leading Equipment Makers Post Steady Growth
Naura Technology Group and AMEC (Advanced Micro-Fabrication Equipment), China’s leading semiconductor equipment makers, have released their 2025 annual reports one after another. Against a backdrop of a high global equipment…
Localization Rate of Etch and Thin-Film Deposition Tools Tops 40% as Leaders Push Ahead While the Gap Remains
In the localization of China’s semiconductor equipment, the domestic substitution rate for etch and thin-film deposition has surpassed forty percent, making it a representative area of progress for core process…
