SP-360 Ceramic Plate Cleaner / Dryer

1. Overview

The SP-360 horizontal multi-station spin dryer is mainly used for rinsing and drying of silicon wafers, photomasks, solar cells and similar materials, and also suits sapphire wafers and touch screen glass substrates. It is one of the essential tools in semiconductor wet-cleaning process. Equipped with 1 process chamber, it supports rinsing and drying of 305/360 ceramic plates.

2. Key Specifications

Product: Ceramic Plate Cleaner
Model: SP-360
Applicable Sizes: 305 / 360 ceramic plates
Plates per Cycle: 1 pc
Rotation Speed: 100 ~ 2000 r/min
Drying Time: 5 ~ 10 min
Chamber Heating: Electric heater
Rinse Water: 0.25~0.3 MPa, port 3/8"
Shaft Seal N2: 0.2 MPa, port Φ4mm
Compressed Air: 0.25~0.3 MPa, port Φ8mm
Control System: Mitsubishi PLC
Display: 7" Touch Screen
Power Supply: AC 220V
Rated Power: 7 KW
Dimensions (L×W×H): 1200 × 1100 × 786 mm

3. Structure & Features

■ Stainless steel frame + PP housing: SUS304 frame with 10mm PP panels, corrosion resistant with low particle outgassing, fully meeting cleanroom requirements.
■ Customized brushless motor: dedicated brushless motor and controller for stable, reliable operation and cleanroom-grade cleanliness.
■ Precision dynamic-balance rotating mechanism: end-face support shortens the shaft and precision dynamic balancing reduces resonance.
■ SUS316L process chamber: 1 chamber in electropolished 316L stainless steel, corrosion resistant and easy to clean; the carrier is replaceable.
■ PFA clean piping: DI water and N2 lines all in PFA, ultra-low ionic outgassing for high-purity process.
■ N2 shaft seal: motor shaft sealed with N2 to isolate process chamber from outside contamination.
■ N2 heating (optional): 316 stainless heater, temperature switch controlled at 80°C.
■ Exhaust system: square chamber outlet transitions to round 100mm duct for smooth exhaust.

4. Optional Units

■ DI water control unit: swirl rinse nozzles; resistivity probe on drain monitors water quality; N2 purges DI water residue from rinse lines after each cycle; standby water flow adjustable.
■ N2 control unit (optional): SMC solenoid valves, PFA high-purity fittings, PTFE pneumatic valves; 316 stainless heater at 80°C; high-purity regulator with built-in N2 filter, 0.003 μm.
■ Antistatic control unit (optional): high-voltage generator, N2 ionization chamber and N2 control channels ionize N2 to neutralize static across the chamber.
■ Electrical control & software: Mitsubishi PLC + 7" touch screen with multiple user recipes, time/speed settings, password protection, fault indication and alarms with auto-stop.

5. Process Flow

DI water rotary rinse + centrifugal drying: rinse 100s @ 300 r/min with DI water; drying 600s @ 1000 r/min with filtered fresh air at 80°C.

6. Applications

Silicon wafers, photomasks, solar cells, sapphire wafers, touch screen glass substrates, 305/360 ceramic plates.